公司名称：胶水公司

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乐泰 3128 is a one part, heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on aide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies.
Particularly suited where low curing temperatures are required for heat sensitivecomponents.
TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.6Yield Point, 25 °C, mPa•sCone & Plate Rheometer44,000Casson Viscosity @ 25 °C, mPa•s (cP)Cone & Plate Rheometer7,000 to 27,000LMSPot life @ 25 °C, weeks 3Shelf Life @ -25 to -15 °C, days
TYPICAL PROPERTIES OF CURED MATERIAL Cured for 60 minutes @ 80 °Physical Properties Density @ 25 °C, g/cm3 1.7Volume Shrinkage, ASTM D 792, % 3.1Linear Shrinkage, ASTM D 792, % 1.0Shore Hardness, ISO 868, Udometer D 88Glass Transition Temperature, °C:(Tg) via TMA , ISO 11359-2 45Coefficient of Thermal Expansion, ISO 11359-2, K-1:alpha 1 40×10-6alpha 2 130×10-6Water Absorption, ISO 62, %:24 hours in water @ 23 °C 0.17Elongation, at break, ISO 527-3, % 2.3StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product container labeling. Optimal Storage: -15 °C to -25 °C. Storage below minus (-)25 °Cor greater than minus (-)15 °C can adversely affect product properties.
乐泰 3128是热固化环氧树脂的一部分。
该产品设计为在低温下固化，并在相当短的时间内在各种材料上提供优异的附着力。典型应用包括存储卡，CCD / CMOS组件。特别适用于热敏组分需要低固化温度。
固化材料的特性：25°