公司名称：胶水公司

ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/ECCOBOND C850-6电子组装/工业胶水/电子组装胶水/工业用胶

技术服务热线：021-51693135 / 021-22818476

ECCOBOND C850-6 die attach epoxy adhesive was designedfor bonding most plastic packaged ICs and other die attachapplications.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield , mPa•s (cP):
Speed 5 rpm, #TC 100,000
Density, g/cm3 3.2
Shelf Life @ 0°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 125°C or
30 minutes @ 150°C or
1 minute @ 250°C
Post Cure
1 to 2 hours at the highest expected use temperature
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: 0 °C
ECCOBOND C850-6贴片环氧胶粘剂设计用于粘合大多数塑料封装IC和其他裸片附着
应用程序。
固化材料的典型特性
粘度，布鲁克菲尔德，mPa•s（cP）：
速度5 rpm，#TC 100,000
密度，g / cm 3 3.2
保质期0°C，月6
闪点 - 参见MSDS
典型的固化性能
治愈时间表
125℃下1小时或
在150°C或30分钟
250°C 1分钟
后治
在*高预期使用温度下1至2小时以上治疗方案是指导性建议。治愈条件（时间和温度）可能会有所不同
客户的经验和应用要求以及客户固化设备，烤箱装载和实际烘箱温度。存储将产品存放在未开封的容器中，干燥处。存储信息可能会