公司名称：胶水公司

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技术服务热线：021-51693135 / 021-22818476

EO1088 epoxy encapsulant particularly suited for use ontransistors and similar semiconductors,and can be used forencapsulation of watch ICs. The cured material survivessevere thermal shock and offers continuous service to 177 °C.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield - RVF, 25 °C, mPa•s (cP):
Spindle 7, speed 4 rpm 6,200
Specific Gravity 1.56
Shelf Life @ 4°C, months 12
Gel Time @ 121oC, minutes 3.5
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
30 minutes @ 150°C
Alternative Cure Schedule
90 minutes @ 140°C or
2 hours @ 120°C
The above cure profile is a guideline recommendation. Cure conditions(time and temperature) may vary based on customers' experience andtheir application requirements, as well as customer curing equipment,oven loading and actual oven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product container
labeling.Optimal Storage: 4 °C
EO1088环氧密封剂特别适用于晶体管和类似的半导体，并可用于手表IC封装。固化的材料存活下来严重的热冲击，并提供连续服务至177°C。
固化材料的典型特性
粘度，Brookfield - RVF，25℃，mPa•s（cP）：
主轴7，转速4 rpm 6,200
比重1.56
保质期4℃，月12日
凝胶时间@121oC，分3.5
闪点 - 参见MSDS
典型的固化性能
推荐治疗时间表
在150°C 30分钟
替代治疗计划
在140°