公司名称：胶水公司

乐泰 3611电子组装/乐泰 3611电子组装/乐泰 3611电子组装乐泰 3611电子组装//工业胶水/电子组装胶水/工业用胶

技术服务热线：021-51693135 / 021-22818476

乐泰 3611 is designed for bonding of surface mounted
devices to printed circuit boards prior to wave soldering.
Particularly suited where very fast cure is required on high
speed SMT lines. The very low moisture absorption allows
longer exposure to humidity in open baths, without affecting
dispensability or causing void formation in the cured adhesive.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.3
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
125 to 400LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
20 to 50
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat
above 100 °C (typically 90-120 seconds @ 150 °C). Rate of
cure and final strength will depend on the residence time at the
cure temperature. Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or
greater than 8 °C can adversely affect product properties
乐泰 3611设计用于表面贴装
设备到波峰焊前的印刷电路板。
特别适用于需要高速固化的地方
高速SMT线。非常低的吸湿性允许
更长时间暴露于露天浴室的湿度，而不影响
可固化或在固化的粘合剂中形成空隙。
固化材料的典型特性
25°C比重1.3
屈服点，25°C，Pa
锥板流变仪：
Haake PK 100，M10 / PK 1 2°锥
125到400LMS
卡松粘度@ 25°C，Pa∙s
锥板流变仪：
Haake PK 100，M10 / PK 1 2°锥
20到50
闪点 - 见SDS
典型的固化性能
固化的推荐条件是暴露于热量
高于100℃（通常在150℃下为90-120秒）。比率
治愈和*终的力量将取决于在的停留时间
治愈温度。
存储
将产品存放在未开封的容器中，干燥处。
存储信息可能会在产品容器上显示
标签。
*佳储存：2°C至8°C。储存温度低于2°C或
大于8°C可能会对产品性能产