公司名称：乐泰|乐泰胶水

ABLEBOND®8175A乐泰胶水，电子胶
ABLEBOND®8175A乐泰胶水，电子胶
ABLEBOND®8175A乐泰胶水，电子胶
ABLEBOND®8175A乐泰胶水，电子胶
ABLEBOND®8175A乐泰胶水，电子胶
ABLEBOND®8175A乐泰胶水，电子胶
ABLEBOND®8175A乐泰胶水，电子胶
ABLEBOND®8175A乐泰胶水，电子胶
ABLEBOND®8175A乐泰胶水，电子胶

技术服务热线：021-51693135 / 021-22818476


ABLEBOND®8175A专为微电子互连应用中的焊料更换而设计。 该粘合剂可以与厚膜金属化或传统印刷电路板表面一起使用。 当使用不锈钢筛网或金属掩模模板打印时，它能够分辨细间距分辨率（0.02英寸）。
典型的固化性能
治疗时间表在150°C 3分钟
替代治疗时间表6分钟@ 130°C
存储
将产品存放在未开封的容器中，干燥处。存储信息可能在产品容器标签上显示。*佳存储：-40°C从容器中取出的物质在使用过程中可能会受到污染。 不要将产品返回原来的容器。
ABLEBOND® 8175A is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metallizations or traditional printed circuit board surfaces. It is capable of resolving fine pitch resolution (0.02 inch) when printed using either a stainless steel mesh screen or a metal mask stencil.
TYPICAL CURING PERFORMANCE
Cure Schedule3 minutes @ 150°C
Alternative Cure Schedule6 minutes @ 130°C
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product container labeling.Optimal Storage: -40 °C Material removed from containers may be contaminated during use. Do not return product to the original container