公司名称：乐泰|乐泰胶水

乐泰 ABLESTIK ABP 8062T乐泰胶水，电子胶水
乐泰 ABLESTIK ABP 8062T乐泰胶水，电子胶水乐泰 ABLESTIK ABP 8062T乐泰胶水，电子胶水乐泰 ABLESTIK ABP 8062T乐泰胶水，电子胶水乐泰 ABLESTIK ABP 8062T乐泰胶水，电子胶水乐泰 ABLESTIK ABP 8062T乐泰胶水，电子胶水
技术服务热线：021-51693135 / 021-22818476

产品描述
技术BMI混合
外观银膏
治疗热固化
应用芯片附件典型包装
应用MOSFET
乐泰 ABLESTIK ABP 8062T配方为提供从功率器件产生的高热传递。该材料也可以用作需要高导热性和导电性的应用的软焊剂。 乐泰 ABLESTIK ABP 8062T高填充芯片附着胶适用于高可靠性封装中需要热导电性和导电性的中小尺寸芯片。
典型的固化性能
治愈时间表
从25℃升温至200℃±30分钟45分钟@
在N2或空气烘箱中200°C
替代治疗时间表
45分钟从25°C升高到185°C + 30分钟@
在氮气或空气烘箱中185℃
存储
将产品存放在未开封的容器中，干燥处。存储信息可能在产品容器标签上显示。*佳存储：-40°C使用中从容器中取出的物质可能会被污染。不要将产品返回原来的容器。
PRODUCT DESCRIPTION
Technology BMI Hybrid
Appearance Silver paste
temperatures
Cure Heat cure
Application Die attachTypical Package
Application MOSFET
乐泰 ABLESTIK ABP 8062T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity. 乐泰 ABLESTIK ABP 8062T highly filled die attach adhesive is suited for small to middle die sizes where thermal and electrical conductivity are needed in a high reliability package.
TYPICAL CURING PERFORMANCE
Cure Schedule
45 minutes ramp from 25°C to 200°C + 30 minutes @
200°C in N2 or air oven
Alternate Cure Schedule
45 minutes ramp from 25°C to 185°C + 30 minutes @
185°C in N2 or air oven
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product container labeling.Optimal Storage : -40 °C Material removed from containers may be contaminated during use. Do not return product to the original container