公司名称：众成三维电子(武汉)有限公司

众成三维电子（武汉）有限公司，位于湖北省葛店经济开发区光谷联合科技城，公司是专业从事平面、三维无机非金属基电子线路和电子元器件研发、生产、销售为一体的高新技术企业。公司拥有国内知名三维电子实验室---武汉光电国家实验室。
公司目前已经量产的产品是氧化铝陶瓷基和氮化铝陶瓷基电路板，采用激光快速活化金属化技术（Laser Activation Metallization,简称LAM技术），金属层与陶瓷之间结合强度高，导电性好，可以多次焊接，金属层厚度在1μm-1mm内可调，L/S分辨率可以达到10μm，能直接实现过孔连接。产品在研发和生产过程中已经申请和授权多项中国发明专*利，相关技术拥有完全自主知识产权，目前一期产能为年产1000m2。
公司拥有专业的管理、生产、技术研发、营销团队以及良好的软件和硬件设施。系统化的营运管理和决策流程，严谨的存货管理体系，保证其产能的灵活性与生产力，为全球客户提供*专业、快速、优质的贴心服务。

Zhong Cheng 3D Electronic (Wuhan) Co., Ltd (the ZC3D) located in Optics Valley Union Technology City, Gedian Economic & Technological Development Zone, Hubei province. The ZC3D is a high-tech enterprise specializes in R&D, manufacture and sale of microelectronic packaging and substrate technologies. Cooperated with Wuhan National Laboratory for Optoelectronics, WNLO, is one of the first five national laboratories authorized in November 2003 by the Ministry of Science and Technology of the P. R. China.
The main products include circuit board based on Al2O3 and AlN substrates. Laser Activation Metallization (LAM) technology is specifically developed for substrate metallization. LAM’s several advantages include high bonding strength between Cu and ceramic, low electrical resistance Cu lines, unique welding performance, thickness of Cu can be controlled in 1μm-1mm, fine line resolution of 10μm, and via-filling by electroplating. A series of state patents have been applied and licensed during product research and development. The initial capacity of 1000m2 product a year is formed.
The ZC3D has a number of highly qualified management personnel and professional production team, the implementation of scientific and rational management. The products have been tested by state authentic departments, and the concerning technology target conforms to and even exceeds the standards of international similar products. That is a guarantee of providing the most professional, most rapid, and most attentive services for global customers.