公司名称：乐泰|乐泰胶水

ABLEBOND 84-1LMISR4 乐泰胶水，导电芯片胶水
ABLEBOND 84-1LMISR4 乐泰胶水，导电芯片胶水ABLEBOND 84-1LMISR4 乐泰胶水，导电芯片胶水ABLEBOND 84-1LMISR4 乐泰胶水，导电芯片胶水ABLEBOND 84-1LMISR4 乐泰胶水，导电芯片胶水ABLEBOND 84-1LMISR4 乐泰胶水，导电芯片胶水ABLEBOND 84-1LMISR4 乐泰胶水，导电芯片胶水ABLEBOND 84-1LMISR4 乐泰胶水，导电芯片胶水
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ABLEBOND 84-1LMISR4导电芯片附着胶已经配制成用于高通量，自动贴片设备。 ABLEBOND 84-1LMISR4胶粘剂的流变性允许*小的粘合剂分配和模具停留时间，无拖尾或拉丝问题。粘合性能的独特组合使得该材料成为半导体行业中应用*广泛的模具附着材料之一。
典型的固化性能
治愈时间1小时@ 175°C
替代治疗时间表在175°C（1）175℃升温至1分钟3〜5分钟
Cure10 x 10 mm硅片上的重量损失在玻璃片上死亡，％5.3
存储
将产品存放在未开封的容器中，干燥处。储存信息可能在产品容器标签上显示。*佳储存温度：-40°C。低于（ - ）40°C或以上（ - ）40°C以下的储存可能会对产品性能产生不利影响。从容器中取出的物质在使用过程中可能会受到污染。不要将产品返回原来的容器。
ABLEBOND 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput,automated die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems.The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.
TYPICAL CURING PERFORMANCE
Cure Schedule1hour @ 175°C
Alternative Cure Schedule3 to 5 minute ramp to 175°C + 1 hour @ 175°C (1)
Weight Loss on Cure10 x 10 mm Si die on glass slide, % 5.3
Storage
Store product in the unopened container in a dry location.Storage information may be indicated on the product container labeling.Optimal Storage: -40 °C. Storage below minus (-)40 °C or greater than minus (-)40 °C can adversely affect product properties.Material removed from containers may be contaminated during use. Do not return product to the original container